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Metal mask cleaner Product List

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Points to confirm for metal mask cleaning: How to choose cleaning agents and cleaning methods.

It is possible to carry out cleaning with consideration for the environment! Introducing cleaning know-how.

This page provides an explanation of the key points to consider in metal mask cleaning. By selecting the appropriate cleaning agents and methods, it is possible to improve cleaning efficiency and work productivity, as well as reduce running costs, ensure worker safety, and implement environmentally considerate cleaning practices. Please check again. *For more details, you can view them through the related links. For further information, please refer to the PDF materials or feel free to contact us.

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Metal mask cleaning agent "ZESTRON SW" *Can be used without vacuum drying.

Due to its wide applicability, it reliably removes cream solder from the back of the metal mask!

"ZESTRON SW" is a solvent-based cleaning agent with a high flash point, developed in collaboration with major SMT printer manufacturers, and can be used without vacuum drying. It excels in the reproducibility of cleaning results and improves the reliability of the printing process as it leaves no residue after drying. Unlike isopropanol (IPA, flash point: 12°C), this product (flash point: 67°C) significantly enhances safety during the operation of metal mask printers. 【Features】 ■ Dries quickly on the metal mask after wiping with a dry non-woven cloth, leaving no residue ■ Leads to good printing stability and a reduction in solder balls ■ Reduces the frequency of cleaning cycles ■ Biodegradable ■ Approved for use in SMT printers by major manufacturers worldwide *For more details, please refer to the PDF document or feel free to contact us.

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Water-based cleaning agent for metal masks VIGON SC 200

Sure! Here is the translation: "A water-based metal mask cleaner that reliably cleans cream solder and SMT adhesive, also usable for wiping the back of printing machines."

VIGON SC 200 is a room temperature water-based cleaning agent developed for cleaning metal masks. It is suitable for spray and ultrasonic cleaning machines and can also be used for cleaning test print circuit boards. Depending on the type of flux, it can be used on printed circuit boards that have already been soldered on one side due to printing errors. 【Features】 - It can separate and remove flux from the cleaning solution, extending the life of the cleaning solution and reducing costs. - No need to replace the cleaning solution, which simplifies maintenance. - Improved workability and environmental conservation achieved through low odor, low VOC, and environmentally friendly components. - Safe line management due to no flash point. - Excellent cleaning performance at room temperature (25°C). - Superior cleaning ability for Pb-free, halogen-free, and eutectic solders. *For more details, please refer to the PDF document or feel free to contact us.

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Metal mask cleaning agent

Can be used as a substitute for IPA (isopropyl alcohol) and acetone.

This is an introduction to a low-toxicity mask cleaning agent handled by Sankyo Chemical Co.

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Improving solder release during solder paste printing! Metal mask cleaning agent.

Prevents residue from cleaning agents! A metal mask cleaning agent that achieves stable printing quality.

Are the residues left after cleaning causing the next defects? Some cleaning agents that emphasize cleaning power leave sticky residues after drying. Such residues can affect the solder release properties and stencil release properties of metal masks, potentially leading to a decline in printing quality and the occurrence of defects. The HA series of metal mask cleaning agents is designed to maintain high cleaning performance while minimizing residues after cleaning, keeping the openings and the surface of the metal mask in a clean state. It ensures stable solder transfer performance and contributes to reducing printing variations and stencil release defects, supporting continuous quality improvement and yield enhancement.

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Cleaning the solder paste from fine openings without leaving any behind to resolve printing defects!

Solve printing defects caused by opening clogging! HA series metal mask cleaning agents improve the printing quality of fine patterns.

Is that opening really clean? With the miniaturization of electronic components, the openings in metal masks are becoming finer year by year. If solder paste or flux residues remain inside the openings, it can lead to insufficient printing, stencil peeling defects, and bridging defects, hindering the stabilization of production quality. The HA series of metal mask cleaning agents efficiently removes adhered solder paste and flux residues due to their high cleaning performance, which easily penetrates fine openings. By maintaining the opening rate after cleaning, it contributes to stabilizing printing accuracy and reducing defect rates, supporting quality improvement and yield enhancement in fine pattern mounting.

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Ignition point, cleanliness, odor... Solving the challenges of metal mask cleaning with IPA.

Solving the issues of printing defects caused by clogged openings! Metal mask cleaning agent.

Are you enduring unpleasant odors and dangers every time you clean? IPA is widely used for metal mask cleaning, but strong alcohol odors, fire risks, and burdens on workers can be problematic. Additionally, frequent handling can lead to increased burdens in safety management and storage management. The HA series of metal mask cleaning agents supports a review of cleaning processes that rely on IPA. With high cleaning power, it shortens cleaning time while contributing to improved workability and better on-site environments. It is a suitable cleaning solution for implementation sites aiming to balance safety and cleaning quality.

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